Silicone Thermal Conductive Gap Pad

 LiPOLY’s AS series has low oil-bleeding characteristics under high compression which can prevent the product from polluting electronic components due to silicon oil seepage, or combining with dust in the environment, causing dirt and affecting product appearance. It’s a best choice of gap filler material with thermal conductivity: 2.0~4.0W/m*K. Hardness Shore OO/30~40 provides flexibility, compressibility and insulation. Shiu Li has professional research and development capabilities which can provide cutting-edge thermal solutions immediately to meet all customers’ need for today’s advanced products.

 

 

  • AS200-s
    Datasheet
  • AS400-s
    Datasheet
  • Product Series Introduction

    Due to Internet of Things raise, electrical products has tendency to lighter, also with high power, high-speed, and high density. Because of the high power module pursued lighter, high density, high power, and the design of the chip and component pursued high capability, high baud, high efficiency, cause the waste heat and hotspot temperature rise quickly, which become the problem in desperate need to solve.